IMAPS UK – Fundamentals of Electronic Packaging Tutorial – Circuit Nano-Surgery and Failure Analysis

IMAPS UK – Fundamentals of Electronic Packaging Tutorial – Circuit Nano-Surgery and Failure Analysis

NanoScope gave an Online invited Tutorial on behalf of IMAPS UK on the 18th September on the subject of Focused Ion Beam (FIB) Circuit Nano-Surgery and Failure Analysis from Board to Gate. The Tutorial Archives can be accessed here. This presentation included a comparison of Cross Sectioning techniques with a comparison of the benefits and limitations of each method. Conventional Mechanical sectioning (with extended capabilities) vs FIB micro-sectioning vs Plasma FIB Sectioning. Also included was an introduction to the techniques of Silicon IC Circuit Nano-Surgery and other IC specific techniques that are now becoming possible to perform on package substrates, system boards, complex packages and other novel die mounting technologies. This presentation can be downloaded and viewed here with just the slide stack is available...