New ‘best in class’ ex-situ FIBxTEM lift-out system launched

New ‘best in class’ ex-situ FIBxTEM lift-out system launched

The perfect addition to any FIB or FIB-SEM laboratory, a high performance optical microscope with ultra long working distance lenses and an ‘ex-situ‘ FIBxTEM section lift-out manipulator. Go to the full product description here. Our engineers (in previous roles) configured and supplied the first version of the ex-situ lift out system to all international FIB and FIB-SEM markets for over 10 years. Now we have created a new ‘best in class’ configuration to maximise the benefits of the ex-situ approach across the widest range of materials systems. If you are not sure of the advantages of ex-situ vs in-situ, read our technical article describing all the pro’s and con’s of both techniques here. The new system configuration has been developed with the experience gained from making FIBxTEM sections from over 300 different materials systems over the last 20 years. From catalytic converters to teeth, Indium Antimonide to car paint and carbon fibre composites and nuclear fuel rod liners to aerogel, we’ve used this technique to make successful FIBxTEM sections from all these materials systems, so we know what works and more importantly, what doesn’t. Changes to the stage design, combination lighting sources and lenses, ensure that the system delivers the highest success rate possible.  In addition we have taken advantage of new manufacturing capabilities and techniques, so the system is far more economical than any other ex-situ lift-out solution which has been offered until now. Our fully capable  ‘ECO’ configuration is available for £19,650 (€24,955) with immediate delivery. To see the full product description and specifications go to the lift-out page here.  Or to get a PDF brochure click...
In-situ or Ex-situ?  Get an unbiased view on which TEM section lift-out method is best for you.

In-situ or Ex-situ? Get an unbiased view on which TEM section lift-out method is best for you.

NanoScope FIB technology article. Just posted here is the full article discussing the relative merits of both methods of FIBxTEM section extraction and the factors to consider when choosing which is better for your sample types. You may think the answer is a foregone conclusion, with in-situ foil extraction being clearly more advanced and more effective as an extraction method than ex-situ, but hold on to that thought, as there may be some less obvious issues that are worth your consideration. Included here is a detailed analysis of each of these rival techniques across the following areas of applicability – 1st      Speed – with the hands down winner being ex-situ 2nd     Yield – more controversial with advocates on both sides 3rd     Quality issues (of the section produced) 4th     Cost – a clear winner here 5th     Versatility – not such a common topic but vital for TEM users 6th     Ease of use – this must be a slam dunk or? 7th     Special circumstances Lets just check our terms and the common perception of what’s what for this technique. FIBxTEM section or foil = The site specific FIB milled sample biopsy that is FIB polished to become electron transparent and extracted to a TEM grid before being transferred to a TEM microscope for more detailed studies. ‘in-situ’ foil extraction – where a ‘thick’ biopsied section is transferred to a TEM grid inside the FIB-SEM instrument using a nano-manipulator and attached there before being FIB polished to the required ‘thinness’ and then transferred to a TEM. ‘ex-situ’ foil extraction – where a site specific feature is thinned to electron transparency BEFORE extraction, then...
IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings....
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