IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings....
New plastic package decapsulation capability launching soon.

New plastic package decapsulation capability launching soon.

            NanoScope is bringing additional capabilities in house – from Unisem. Unisem has been a key supplier for NanoScope Services for many years, and we have worked closely together to offer our clients the best support available from both sites. The unfortunate recent closure of the Unisem Crumlin site has been widely seen as a reduction in the strategic capabilities of the UK semiconductor industry, both in terms of the equipment available but also the extensive experience of the engineers who worked there. However, NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory. We plan to offer Dual-acid decapsulation from early February 2014, with even shorter turnaround times than previously, with other techniques to follow. For more information please contact Lloyd Peto at NanoScope on 07768 172049 Or email...
NanoScope adds a Nano-Surgery flavour to NMI IP Integration Networking Event

NanoScope adds a Nano-Surgery flavour to NMI IP Integration Networking Event

IP integration can be a shortcut to market if effectively executed, but has many pitfalls for the unwary. Nano-Surgery as a fast remedial option provides an extra level of security to designers using acquired IP for new products. Our invited presentation titled ‘When Integration Goes Wrong – your Nano-Surgery Options’ was given at the recent NMI meeting at Imagination Technologies in Kings Langsley...
The Problem With Copper Bond Wires…. For Designers

The Problem With Copper Bond Wires…. For Designers

In this short piece I’m linking Semi Design groups to an increasingly important discussion in the Semi Failure Analysis group. Here’s the link Why? Because materials decisions made about bonding and packaging are not just downstream from the design process, they have important effects on how a Design cycle can be shortened by facilitating – or inhibiting – verification, modification and test. As a Failure Analyst the reasons for getting into packages while leaving the devices functional is obvious (to understand problems) and is an important step as you can see from the active discussion linked here. But as a FIB-Chip Design-Nano Surgeon supporting design teams with circuit edit, I also need routine access to functional opened devices. Using FIB Nano-Surgery in the Design Verification process is quite commonplace, either to confirm metal fixes before implementing layout changes, or getting 1st Silicon through test and starting applications board testing. So the link between how you correct a design flaw and open a package, is increasingly important for shortening design times. The move from Gold to Copper bond wires shaves a finite fraction from the cost of bonding a device, but also presents an additional challenge for opening up these packages. The discussion here shows many different approaches being tried as people try to adapt the Gold or Aluminium compatible ‘opening’ processes and existing hardware, to handle Copper (instead of instantly dissolving it). Decap tool vendors provide valuable insight with information about their latest Copper specific solutions. The danger is that the unpredictable and sometimes involved process of Design Verification and specifically FIB nano-surgery, may not have been fully factored in to that cost/material decision along...
FIB is cool – but what about blogging?

FIB is cool – but what about blogging?

Apparently the only two things that you should never try are folk music and incest, so blogging must surely be in the other column. Well here goes…. I’m a first generation pure FIB technologist – in that my first microscope was a Focussed Ion Beam instrument and I only learned how to use an SEM and other techniques later on. The immediacy and interactive nano-surgery capabilities of the technology, captured my interest on day one, and I’m as hooked now as I was then. Since 1992 I have been lucky enough to work for Rutherford Appleton, FEI Company (twice)- now Thermo, Micrion Corporation (now FEI), Raith GmbH and now NanoScope Services. I’ve helped develop many of the main aspects of how this technology is employed – from writing the first published FEI TEM sample prep protocol, and developing new sample holders for the 611 and FIB 800, through 3D gun-shot residue and forensic analysis and AFM tip customisation, and leading the applications initiative for using Cryo-DualBeam within the Life-Sciences. The latest major project was developing and rolling out an entirely new FIB technique for truly automated 3D nano-fabrication using ultra fine Ga+ beams now called IBL or Ion Beam Lithography for Raith GmbH (see ionLiNE ). I have become co-author on over 100 publications for this application alone. ( I don’t have time to write papers myself). FIB is cool, and everyday we get to do cool new stuff for scientists and engineers from across the Nanotech spectrum. From Circuit Edit to Solid State Nanopores and frozen Fibroblast sectioning, from VCSELs and OLED’s to GSR and FZP’s, FIB is enabling...
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