The latest technical articles, project guidelines, service announcements, newsletters and case studies – just grab what you need.
“In-situ or Ex-situ? Which TEM section lift-out method is best?” You may think the answer to this question is a foregone conclusion, but hold that thought until you have read this.
Supporting your design and manufacturing processes – expert FIB ‘Structural Edit’ for rapid prototyping, ‘3D Structural Metrology’ and Failure Analysis when you need it.
With articles on ‘LiveOPTICALTM’, and our success rates for 1st time FIB interventions – a great case study on how multiple high end techniques can be used to solve complex materials problems and some new customer feedback.
NanoScope Services has extended it’s unique LiveFIBTM focused ion beam web conferencing capability, with high resolution Optical Microscopy.
This is our legal framework for performing your work. Please read carefully.
Rapid Circuit Edit to 1st Silicon devices to prove mask changes. Get working devices from your test samples for demonstrations
to prospective clients while your proven and tested design is being fabricated.
Shorten your time to market and guarantee “1st Time Right”.
Save time and expence by preparing your job description effectively, and supplying just the information we need. A few simple tips
to help us find the site quickly and maximise your yield.
Save time and expence by preparing your samples for immediate entry to our equipment and succesfull TEM sample preparation.
A few simple tips to help us find the site quickly and prevent any confusion about the target of the analysis.
‘FIB goes LIVE’ – NanoScope Services introduces a unique innovation in outsourced nanofabrication and analysis services with ‘FIB on the Web’ consultancy.
The introduction of ‘LiveFIBTM’ video conferencing of real time FIB interventions. Also contains articles on ion beam system contaminants from older tools which could affect copper devices during FIB edits and competitive pricing advanatges for NanoScope.
Not used FIB before? not sure what to expect? this simple guide will explain the characteristics of a ‘FIB foil’ and how it differs
from a conventionaly produced section.
Contains articles about our new insulator deposition chemistry for assisting in advanced circuit edit applications, and customised TEM foil preparation.
New non-destructive package analysis services, updated information about (S)TEM sample preparation, a unique competition and more.
Contains features on techniques for advanced circuit edit of copper devices, ultra low resistance copper (power)track deposition, the introduction of our our Cryo-DualBeam technique, the introduction of our new glob topping services, and other items.