Failure Analysts and Product Test Engineers
Electrical Micro-Probing – also to FIB deposited pads connected to buried nodes
Probing permits the driving or monitoring of a voltage or signal at any mid-circuit node(s) with or without available probe pads.
Our micro-probing facility with optical microscope permits direct electrical connection to structures down to 10×10 microns. This is sufficient to connect to power structures and any nodes connected to FIB deposited probe pads in a device.
We have a number of different probe types available or customers can repeat their own tips setup and test condition. Power supplies and a Tektronix curve tracer are on-site and available for your use to support your test protocol and confirm your FIB-layout edits and functionality changes are successful.
For a detailed description of the equipment and techniques available, go to the Tools and Techniques page.
There are 3 clear advantages
- It can be QUICK as it can be done directly on opened circuits without changing the device layout.
- IT WORKS ON PASSIVATED TOP LAYER TRACKS – by using FIB to open windows in the passivation coating.
- IT WORKS ON BURIED NODES –by first depositing a FIB probe pad on top of the passivation and connecting it down to the target node.
Don't be shy, get in touch.
If you are not sure about an aspect of this technique we’re happy to chat through it with you.
IC Decap, MEMS Gel coat removal and through WL-CSP modification capabilities available nowread more
Just posted here is the full article discussing the relative merits of both methods of FIBxTEM section extraction and the factors to consider when choosing which is better for your sample types.read more
NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities.
This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks.