Failure Analysis Service

Advanced Microscopy enabled FA services for Semiconductor clients

Failure Analysis /Quality Engineers

Based around our advanced Microscopy and FIB expertise, NanoScope offer a suite of fast turn Failure Analysis services for our semiconductor clients.

Each analysis can be specified for 3 levels of detail, depending on your time-line for resolving the issue and budgetary requirements.

  • Basic – an initial investigation to check specifically defined elements are in order.
  • Intermediate – a more in depth investigation checking the specifics of the product in line with the specifications stated.
  • Detailed – a more involved investigation to identify the route cause of a specific problem which may involve a more iterative approach and more detailed consultation.

We are happy to offer cost-free initial consultancy for selecting which procedures and techniques are the most applicable for solving your issue the most efficiently.

Services offered

  • External optical examination
  • Build a test socket board
  • Basic benchtop electrical testing
  • X-ray package analysis
  • CSAM package analysis
  • Decapsulation
  • Internal optical inspection
  • Anti-counterfeit check (structure/features)
  • FIB/FEG-SEM internal inspection
  • In-circuit electrical micro-probing (inc. to FIB probe pads)
  • FIB Sectioning and imaging (w/wo iterative slicing)
  • Process Metrology (inc. SI/SE imaging)
  • SEM EDS studies
  • FIBxTEM Sectioning
  • TEM imaging analysis (TEM/STEM) – BF/DF
  • TEM X-ray or EELS elemental analysis
  • Written report

Based on your description of the issue identified, we will propose a workflow with a level of detail and a cost for the analysis process prior to starting the project. Should additional investigative work be required during the analysis this can be easily added at the time.

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EMMI fault finding with metal layers removed by FIB.

 

8August

Non-destructive X-ray analysis of packaged parts.

AFeb

Adding probe pads to any node for electrical debug.

New ‘best in class’ ex-situ FIBxTEM lift-out system launched

The perfect addition to any FIB or FIB-SEM laboratory, a high performance optical microscope with ultra long working distance lenses and an ‘ex-situ’ FIBxTEM section lift-out manipulator. Our new ‘best in class’ configuration maximises the benefits of the ex-situ approach across the widest range of materials systems.

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