News & Articles

Keep upto date with all the latest NanoScope news and technical articles.

NanoScope to present at the 4th Admati Technical Seminar at the Tel Aviv Hilton on 28th April 2015.

    Press release 10th March 2015 Every two years Admati Agency hosts an ‘invite only’ technical seminar for their growing customer base and some new invitees in Israel. The seminar provides a forum for introducing the latest developments from the firms represented by Admati and also to introduce the capabilities of the latest companies to join the group since the last meeting. NanoScope partnered with Admati in 2014 and this year we will present our Semiconductor and high tech support services at this seminar for the first time. This year the seminar will be held on the 28-April-2015 at the Tel Aviv Hilton. We will be presenting our capabilities for advanced FIB (Focused Ion Beam) IC circuit nano-surgery, single node Failure Analysis with comprehensive de-capsulation capabilities, rapid Fab process qualifications and advanced microscopy for small geometries and materials analysis. Other companies presenting will be: Intel – Case study presentation Reltech – Independent Reliability testing services Phasix ESD – Independent ESD testing services Special guest speaker (to be announced) ThermoFisher Scientific, Interconnect Devices (IDI) and others to be confirmed. A more detailed agenda will be released nearer the date to registrants. Representatives from 17 major Israeli semiconductor companies are registered to attend and we expect several more over the coming weeks. If you are interested to learn more about the meeting please contact us here. Request a LinkedIN invite here.      Go to the NanoScope website here. Telephone +44 (0)1179576225       Send an email here. Contact : Lloyd Peto NanoScope Services Ltd. No30 Station Road Workshops Kingswood Bristol BS15 4PJ,... read more

New ‘best in class’ ex-situ FIBxTEM lift-out system launched

The perfect addition to any FIB or FIB-SEM laboratory, a high performance optical microscope with ultra long working distance lenses and an ‘ex-situ‘ FIBxTEM section lift-out manipulator. Go to the full product description here. Our engineers (in previous roles) configured and supplied the first version of the ex-situ lift out system to all international FIB and FIB-SEM markets for over 10 years. Now we have created a new ‘best in class’ configuration to maximise the benefits of the ex-situ approach across the widest range of materials systems. If you are not sure of the advantages of ex-situ vs in-situ, read our technical article describing all the pro’s and con’s of both techniques here. The new system configuration has been developed with the experience gained from making FIBxTEM sections from over 300 different materials systems over the last 20 years. From catalytic converters to teeth, Indium Antimonide to car paint and carbon fibre composites and nuclear fuel rod liners to aerogel, we’ve used this technique to make successful FIBxTEM sections from all these materials systems, so we know what works and more importantly, what doesn’t. Changes to the stage design, combination lighting sources and lenses, ensure that the system delivers the highest success rate possible.  In addition we have taken advantage of new manufacturing capabilities and techniques, so the system is far more economical than any other ex-situ lift-out solution which has been offered until now. Our fully capable  ‘ECO’ configuration is available for £19,650 (€24,955) with immediate delivery. To see the full product description and specifications go to the lift-out page here.  Or to get a PDF brochure click... read more

Agar Press Release 25th June 2014

Press Release 25th June 2014 – Bristol, UK Agar Scientific and NanoScope Services sign collaborative agreement to offer advanced TEM sectioning services. NanoScope Services Ltd., a focused ion beam (FIB) and microscopy laboratory based in Bristol, UK, and Agar Scientific, a wholly owned subsidiary of Elektron Technology UK Ltd. and renowned supplier of microscopy products based in Stansted, UK, have teamed up to offer a unique section preparation service for transmission electron microscopy (TEM) to materials scientists across Europe and beyond. This new FIB technique offers several key technical advantages over conventional mechanical and broad beam section preparation techniques, particularly for complex or difficult materials systems. FIB sections permit a relatively large viewing area in the TEM and may be prepared from very specific features with a minimal amount of mechanical preparation required prior to starting the process. “This new service has been specifically tailored to the needs of industrial and academic materials scientists, giving them easy access to turn-key sectioning services that can save them significant time,” said Lloyd Peto, Commercial Director at NanoScope Services. “Agar Scientific is the perfect partner for us in this market.” Darren Likely, Business Unit Director at Elektron Technology Uk Ltd., added “Agar has a terrifically wide selection of products and accessories to support our sophisticated customer base, and we are pleased to now be able to add outsourced services to this list. The TEM section preparation service from NanoScope has the technical and commercial quality that our customers have come to expect from Agar.” The new TEM section preparation service will be offered through the Agar on-line catalogue and is part of... read more

In-situ or Ex-situ? Get an unbiased view on which TEM section lift-out method is best for you.

NanoScope FIB technology article. Just posted here is the full article discussing the relative merits of both methods of FIBxTEM section extraction and the factors to consider when choosing which is better for your sample types. You may think the answer is a foregone conclusion, with in-situ foil extraction being clearly more advanced and more effective as an extraction method than ex-situ, but hold on to that thought, as there may be some less obvious issues that are worth your consideration. Included here is a detailed analysis of each of these rival techniques across the following areas of applicability – 1st      Speed – with the hands down winner being ex-situ 2nd     Yield – more controversial with advocates on both sides 3rd     Quality issues (of the section produced) 4th     Cost – a clear winner here 5th     Versatility – not such a common topic but vital for TEM users 6th     Ease of use – this must be a slam dunk or? 7th     Special circumstances Lets just check our terms and the common perception of what’s what for this technique. FIBxTEM section or foil = The site specific FIB milled sample biopsy that is FIB polished to become electron transparent and extracted to a TEM grid before being transferred to a TEM microscope for more detailed studies. ‘in-situ’ foil extraction – where a ‘thick’ biopsied section is transferred to a TEM grid inside the FIB-SEM instrument using a nano-manipulator and attached there before being FIB polished to the required ‘thinness’ and then transferred to a TEM. ‘ex-situ’ foil extraction – where a site specific feature is thinned to electron transparency BEFORE extraction, then... read more

NanoScope appoints Admati as Israeli representative.

NanoScope Services has actively supported European clients for many years, and we are now extending our activities into the Israeli semiconductor market. Our offerings of Circuit Nano-surgery (edit), Quick Fab process qualifications, advanced analysis and microscopy and Physical Failure analysis services, can now be seamlessly supported via our local Israeli representatives Admati in Haifa. Founded in 2007 Admati has a strong record of supporting the Fabless community with their expertise of Connection products (Sockets, cables and pins) and Service providers like ThermoFisher, MVTS, Reltech, Phasix, and Corwil. The immediate advantages for Israeli customers using NanoScopes UK facilities (rather than a US lab for instance) may be easily summarised. 1) Expert technologists with extensive experience in all aspects of FIB technology (NanoScope engineers ran the first FIB Service labs in Europe (since 1992 for FEI Company, Micrion Corporation and now NanoScope Services) 2) Same time zone communications and support – with live ‘over the web’ video conferencing to FIB or Optical microscopes available. 3) Shorter Shipping times (1 day each way rather than 2 or 3) = plus our Urgent Service option for engineers in a hurry. 4) Broad in-house knowledge and partner lab network for more complex requests. 5) NanoScope only charge for ‘expert tool time’, and we won’t be beaten on quality or $ per result. For more information about Admati please contact Udi Admati or Ran Sagiv. For more information about NanoScope Services please contact Lloyd Peto  or Alan Miller. To request a LinkedIN invite click here.... read more

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings.... read more

New plastic package decapsulation capability launching soon.

            NanoScope is bringing additional capabilities in house – from Unisem. Unisem has been a key supplier for NanoScope Services for many years, and we have worked closely together to offer our clients the best support available from both sites. The unfortunate recent closure of the Unisem Crumlin site has been widely seen as a reduction in the strategic capabilities of the UK semiconductor industry, both in terms of the equipment available but also the extensive experience of the engineers who worked there. However, NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory. We plan to offer Dual-acid decapsulation from early February 2014, with even shorter turnaround times than previously, with other techniques to follow. For more information please contact Lloyd Peto at NanoScope on 07768 172049 Or email... read more
Page 1 of 212

Subscribe to Our Newsletter

Please sign up to be the first to know when we add something new.

Subscribe Today