'QwikQual'

Chip makers, QwikQual gets your process ramped up or helps correct a yield excursion.

Chip Makers and FAB Product Engineers. ‘QwikQual’ can help get your process ramped up, or speed up the solving of a yield excursion in your process.

Sometimes you need to know what your process tool is achieving at a specific location which is critical to your final yield, and so we have introduced a rapid instrument qualification process for FAB engineers, who need site specific process data on a sameday/next day basis.

Our ‘QwikQual’ service is for 1 or 2 micro cross-sections with imaging and calibrated metrology taken from a specific location to help you independently qualify your manufacturing equipment – specifically for clients who have pre-registered for this service.

We will email the images directly to you as they are produced, allowing you to make quick decisions for your production line and your process.

This service is ideal for foundries who are ‘ramping up’ a new process or for supplying site specific customer qualification data or for non-standard Quals.

Its got to be


  • FAST
  • Independent
  • 
From the right location
  • 
Correct (Accurate)
  • Referenced to traceable standards
  • Reasonably priced

 

How do I do that?


 

  • BEFORE – Sign up to ‘QwikQual’ service
  • TODAY – Ship the sample to us to arrive just after 8am – not before (or before 5pm for next day work) – do this first – 2 sections max
  • Call us for taxi or bike courier contacts
  • TODAY – Email us your sectioning job instructions (guidelines on website) and telephone us to advise that there is a project arriving.
  • TOMORROW – We run the job before ‘start of day’
  • TOMORROW – results emailed to you before 10AM
  • 
PO – draw down to agreed limit
  • You can watch on the web with ‘LiveFIB’ if you want.

In-situ or Ex-situ? Get an unbiased view on which TEM section lift-out method is best for you.

NanoScope FIB technology article. Just posted here is the full article discussing the relative merits of both methods of FIBxTEM section extraction and the factors to consider when choosing which is better for your sample types. You may think the answer is a foregone conclusion, with in-situ foil extraction being clearly more advanced and more effective as an extraction method than ex-situ, but hold on to that thought, as there may be some less obvious issues that are worth your consideration. Included here is a detailed analysis of each of these rival techniques across the following areas of applicability – 1st      Speed – with the hands down winner being ex-situ 2nd     Yield – more controversial with advocates on both sides 3rd     Quality issues (of the section produced) 4th     Cost – a clear winner here 5th     Versatility – not such a common topic but vital for TEM users 6th     Ease of use – this must be a slam dunk or? 7th     Special circumstances Lets just check our terms and the common perception of what’s what for this technique. FIBxTEM section or foil = The site specific FIB milled sample biopsy that is FIB polished to become electron transparent and extracted to a TEM grid before being transferred to a TEM microscope for more detailed studies. ‘in-situ’ foil extraction – where a ‘thick’ biopsied section is transferred to a TEM grid inside the FIB-SEM instrument using a nano-manipulator and attached there before being FIB polished to the required ‘thinness’ and then transferred to a TEM. ‘ex-situ’ foil extraction – where a site specific feature is thinned to electron transparency BEFORE extraction, then...

NanoScope appoints Admati as Israeli representative.

NanoScope Services has actively supported European clients for many years, and we are now extending our activities into the Israeli semiconductor market. Our offerings of Circuit Nano-surgery (edit), Quick Fab process qualifications, advanced analysis and microscopy and Physical Failure analysis services, can now be seamlessly supported via our local Israeli representatives Admati in Haifa. Founded in 2007 Admati has a strong record of supporting the Fabless community with their expertise of Connection products (Sockets, cables and pins) and Service providers like ThermoFisher, MVTS, Reltech, Phasix, and Corwil. The immediate advantages for Israeli customers using NanoScopes UK facilities (rather than a US lab for instance) may be easily summarised. 1) Expert technologists with extensive experience in all aspects of FIB technology (NanoScope engineers ran the first FIB Service labs in Europe (since 1992 for FEI Company, Micrion Corporation and now NanoScope Services) 2) Same time zone communications and support – with live ‘over the web’ video conferencing to FIB or Optical microscopes available. 3) Shorter Shipping times (1 day each way rather than 2 or 3) = plus our Urgent Service option for engineers in a hurry. 4) Broad in-house knowledge and partner lab network for more complex requests. 5) NanoScope only charge for ‘expert tool time’, and we won’t be beaten on quality or $ per result. For more information about Admati please contact Udi Admati or Ran Sagiv. For more information about NanoScope Services please contact Lloyd Peto  or Alan Miller. To request a LinkedIN invite click here....

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings....
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