MEMS Process Engineers

'3D Structural Analysis’ of MEMS structures using FIB solves construction issues.

Understanding the cause of process or functional failures requires the application of various microscopy techniques to site specific locations.

Whether your needs are simple metrology or a more detailed high resolution analysis, both can be delivered from the required location using the nano-sectioning capabilities of FIB. Applying SIM, SEM and TEM, all enabled with FIB, we can help you understand your device structure and any failure modes.

NanoScope’s fast turn-around ‘off the shelf’ expert service, makes this available at every level of MEMS development.

FIBxTEM section preparation from MEMS ‘cog’ (foil width ~20um)

MEMS Structual R&D2

Waveguide metrology – within a FIB milled section (result time 20 mins)

NanoScope appoints Admati as Israeli representative.

NanoScope Services has actively supported European clients for many years, and we are now extending our activities into the Israeli semiconductor market. Our offerings of Circuit Nano-surgery (edit), Quick Fab process qualifications, advanced analysis and microscopy and Physical Failure analysis services, can now be seamlessly supported via our local Israeli representatives Admati in Haifa. Founded in 2007 Admati has a strong record of supporting the Fabless community with their expertise of Connection products (Sockets, cables and pins) and Service providers like ThermoFisher, MVTS, Reltech, Phasix, and Corwil. The immediate advantages for Israeli customers using NanoScopes UK facilities (rather than a US lab for instance) may be easily summarised. 1) Expert technologists with extensive experience in all aspects of FIB technology (NanoScope engineers ran the first FIB Service labs in Europe (since 1992 for FEI Company, Micrion Corporation and now NanoScope Services) 2) Same time zone communications and support – with live ‘over the web’ video conferencing to FIB or Optical microscopes available. 3) Shorter Shipping times (1 day each way rather than 2 or 3) = plus our Urgent Service option for engineers in a hurry. 4) Broad in-house knowledge and partner lab network for more complex requests. 5) NanoScope only charge for ‘expert tool time’, and we won’t be beaten on quality or $ per result. For more information about Admati please contact Udi Admati or Ran Sagiv. For more information about NanoScope Services please contact Lloyd Peto  or Alan Miller. To request a LinkedIN invite click here.... read more

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings.... read more

New plastic package decapsulation capability launching soon.

            NanoScope is bringing additional capabilities in house – from Unisem. Unisem has been a key supplier for NanoScope Services for many years, and we have worked closely together to offer our clients the best support available from both sites. The unfortunate recent closure of the Unisem Crumlin site has been widely seen as a reduction in the strategic capabilities of the UK semiconductor industry, both in terms of the equipment available but also the extensive experience of the engineers who worked there. However, NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory. We plan to offer Dual-acid decapsulation from early February 2014, with even shorter turnaround times than previously, with other techniques to follow. For more information please contact Lloyd Peto at NanoScope on 07768 172049 Or email... read more
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