MEMS Process Engineers
'3D Structural Analysis’ of MEMS structures using FIB solves construction issues.
MEMS Process engineers
Understanding the cause of process or functional failures requires the application of various microscopy techniques to site specific locations.
Whether your needs are simple metrology or a more detailed high resolution analysis, both can be delivered from the required location using the nano-sectioning capabilities of FIB. Applying SIM, SEM and TEM, all enabled with FIB, we can help you understand your device structure and any failure modes.
NanoScope’s fast turn-around ‘off the shelf’ expert service, makes this available at every level of MEMS development.
FIBxTEM section preparation from MEMS ‘cog’ (foil width ~20um)
Waveguide metrology – within a FIB milled section (result time 20 mins)
IC Decap, MEMS Gel coat removal and through WL-CSP modification capabilities available nowread more
NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities.
This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks.
NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory.read more