MEMS Process Engineers
'3D Structural Analysis’ of MEMS structures using FIB solves construction issues.
MEMS Process engineers
Understanding the cause of process or functional failures requires the application of various microscopy techniques to site specific locations.
Whether your needs are simple metrology or a more detailed high resolution analysis, both can be delivered from the required location using the nano-sectioning capabilities of FIB. Applying SIM, SEM and TEM, all enabled with FIB, we can help you understand your device structure and any failure modes.
NanoScope’s fast turn-around ‘off the shelf’ expert service, makes this available at every level of MEMS development.
FIBxTEM section preparation from MEMS ‘cog’ (foil width ~20um)
Waveguide metrology – within a FIB milled section (result time 20 mins)
Here I discuss why the growth in MEMS development is lagging the growth that was witnessed for IC development in many respects – but highlighting that there are valuable lessons available to accelerate future growth too.read more
Accelerate your MEMS Development with FIB Structural Edit and Analysisread more
Apparently the only two things that you should never try are folk music and incest, so blogging must surely be in the other column. Well here goes….read more