Low Cost Reliability Testing

We now offer 3 budget saving Reliability Services for our Semiconductor clients and advanced testing through our partner Reltech

Semiconductor device RELIABILITY Services

NanoScope now offers 3, economical, turn-key reliability services for our Semiconductor clients.

MSL Evaluation

This identifies the classification level of non-hermetically sealed surface mounted solid state devices, which may be sensitive to moisture induced stress. A package’s MSL sets the parameters for subsequent device preconditioning. The basic test sequence is shown below and assumes that pre-and post electrical tests are conducted at the customer site. The test is performed to IPC/JEDEC Standard J-STD-020D.1

  • Initial Visual Inspection
  • 1st Acoustical Microscope (CSAM)
  • Initial Bake – 24 hrs @ 125°C
  • Moisture Soak – Temp/Humidity at required level
  • Reflow (IR bake) X3 @260°c
  • Final Visual Inspection
  • 2nd Acoustical Microscope (CSAM)
  • Optional written report

Device Pre-conditioning

This exposes a batch of devices to the upper limit of the MSL level specified prior to that batch undergoing reliability testing. Pre-conditioning may use all of the sequence shown above – but is often steps 3, 4, and 5 only. The accelerated equivalent tests are also available. Pre-conditioning is available for the full range of MSL’s, and is performed to JEDEC Standard JESD22-A113

High Temperature Storage

HTS is used to test for thermally activated failure mechanisms of solid state devices. Elevated temperatures (150 degrees) are applied for a longer fixed period of time (1000hrs) without electrically stressing the devices. Following HTS, electrical test measurements should be done within 96 hours. The test is performed to JESD22-A103 standard.

Reliability Services Pricing

MSL evaluation <25 devices Price from ₤2,250
Device pre-conditioning <250 devices Price from ₤1,000  (MSL Eval and Pre-Con lots may be combined)
High Temperature Storage <250 devices Price from ₤300

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INTRODUCING our reliability partner RELTECH.

For a full turnkey service with even better savings, we have teamed up with our close neighbour and collaborator RELTECH Ltd to offer a complete portfolio of follow-on reliability tests.
For customers booking MSL or Pre-conditioning services with NanoScope who would like to try Reltech, we can offer you a total solution at a preferential rate, and seamless transfer of your pre-conditioned parts directly to Reltech and return shipping directly to you. Email us here for more information.

All projects are completed to JEDEC Standard JESD47.

Device Qualification Tests

  • High Temperature Operating Life (HTOL) JESD22-A108/JESD85
  • Early Life Failure Rate (ELFR) JESD22-A108/JESD74
  • Low Temperature Operating Life (LTOL) JESD22-A108
  • High Temperature Storage Life (HTSL) JESD22-A103

Non-Hermetic Package Qualification Tests

  • MSL Preconditioning (prior to package tests)  (PC)  JESD22-A113
  • High Temperature Storage (HTS) JESD22-A103 & A113
  • Temperature Humidity Bias (THB) JESD22-A101
  • Biased Highly Accelerated Temperature & Humidity Stress (HAST) JESD22-A110
  • Unbiased HAST (UHAST) JESD22-A118
  • Temperature Cycling (TC) JESD22-A104

NanoScope appoints Admati as Israeli representative.

NanoScope Services has actively supported European clients for many years, and we are now extending our activities into the Israeli semiconductor market. Our offerings of Circuit Nano-surgery (edit), Quick Fab process qualifications, advanced analysis and microscopy and Physical Failure analysis services, can now be seamlessly supported via our local Israeli representatives Admati in Haifa. Founded in 2007 Admati has a strong record of supporting the Fabless community with their expertise of Connection products (Sockets, cables and pins) and Service providers like ThermoFisher, MVTS, Reltech, Phasix, and Corwil. The immediate advantages for Israeli customers using NanoScopes UK facilities (rather than a US lab for instance) may be easily summarised. 1) Expert technologists with extensive experience in all aspects of FIB technology (NanoScope engineers ran the first FIB Service labs in Europe (since 1992 for FEI Company, Micrion Corporation and now NanoScope Services) 2) Same time zone communications and support – with live ‘over the web’ video conferencing to FIB or Optical microscopes available. 3) Shorter Shipping times (1 day each way rather than 2 or 3) = plus our Urgent Service option for engineers in a hurry. 4) Broad in-house knowledge and partner lab network for more complex requests. 5) NanoScope only charge for ‘expert tool time’, and we won’t be beaten on quality or $ per result. For more information about Admati please contact Udi Admati or Ran Sagiv. For more information about NanoScope Services please contact Lloyd Peto  or Alan Miller. To request a LinkedIN invite click here....

IC Decap, MEMS Gel coat removal and ‘through WL-CSP’ FIB edit capabilities available now.

NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities. This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks. By bringing these capabilities in-house we can further reduce the turnaround time of decap work for our semiconductor customers needing urgent Failure Analysis or Circuit Nano-Surgery (Circuit Edit), while ensuring that the quality remains high and the costs remain low. We are very pleased to have increased the depth of expertise within our organisation for supporting a wider range of Failure Analysis applications beyond Circuit Nano-surgery, high end microscopy and physical device analysis. Gel-coat removal for MEMS devices For MEMS clients needing access to Gel coated devices for Failure Analysis, Structural Analysis or Structural modifications with FIB, we have also added a chemical etch  process for packaged MEMS devices.  This service is available with the same fast-turnaround as our other services. A New FIB process for accessing a device ‘through a WL-CSP package’. Circuit Nano-Surgery to a device already packaged with CSP and RDL layers, can now be easily achieved without removing the package in most cases. CSP diagram Working through a CSP layer adds a little time to a surgical process, but has only a small effect on the efficacy or yield of a surgical intervention. Testing advantages WL-CSP packaging can also be a shortcut for the high speed testing of 1st Silicon engineering devices prior to FlipChip packaging. Working through these layers means that more complex edits can be performed ‘top-down’, with lower costs and higher yields, producing some significant time and cost savings....

New plastic package decapsulation capability launching soon.

            NanoScope is bringing additional capabilities in house – from Unisem. Unisem has been a key supplier for NanoScope Services for many years, and we have worked closely together to offer our clients the best support available from both sites. The unfortunate recent closure of the Unisem Crumlin site has been widely seen as a reduction in the strategic capabilities of the UK semiconductor industry, both in terms of the equipment available but also the extensive experience of the engineers who worked there. However, NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory. We plan to offer Dual-acid decapsulation from early February 2014, with even shorter turnaround times than previously, with other techniques to follow. For more information please contact Lloyd Peto at NanoScope on 07768 172049 Or email...
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