FIB Services for Failure Analysts and Product Test Engineers

Electrical Micro-Probing  – also to FIB deposited pads connected to buried nodes

Electrical micro-probing permits the driving or monitoring of a voltage or signal at any mid-circuit node(s) with or without available probe pads.

Our micro-probing facility with optical microscope permits direct electrical connection to structures down to 10×10 microns. This is sufficient to connect to power structures and any nodes connected to FIB deposited probe pads in a device.

We have a number of different probe types available or customers can repeat their own tips setup and test condition. Power supplies and a Tektronix curve tracer are on-site and available for your use to support your test protocol and confirm your FIB-layout edits and functionality changes are successful.

For a detailed description of the equipment and techniques available, go to the Tools and Techniques page.

There are 3 clear advantages

1. It can be QUICK as it can be done directly on opened circuits without changing the device layout.
2. IT WORKS ON PASSIVATED TOP LAYER TRACKS – by using FIB to open windows in the passivation coating. 
3. IT WORKS ON BURIED NODES –by first depositing a FIB probe pad on top of the passivation and connecting it down to the target node.