Failure Analysis Service

Advanced Microscopy enabled FA services for Semiconductor clients across UK & Europe

Failure Analysis /Quality Engineers

Based around our advanced Microscopy and FIB expertise, NanoScope offer a suite of fast turn Failure Analysis services for our semiconductor clients.

Each analysis can be specified for 3 levels of detail, depending on your time-line for resolving the issue and budgetary requirements.

  • Basic – an initial investigation to check specifically defined elements are in order.
  • Intermediate – a more in depth investigation checking the specifics of the product in line with the specifications stated.
  • Detailed – a more involved investigation to identify the route cause of a specific problem which may involve a more iterative approach and more detailed consultation.

We are happy to offer cost-free initial consultancy for selecting which procedures and techniques are the most applicable for solving your issue the most efficiently.

Services offered

  • External optical examination
  • Build a test socket board
  • Basic benchtop electrical testing
  • X-ray package analysis
  • CSAM package analysis
  • Decapsulation
  • Internal optical inspection
  • Anti-counterfeit check (structure/features)
  • High resolution Thermal Imaging
  • FIB/FEG-SEM internal inspection
  • In-circuit electrical micro-probing (inc. to FIB probe pads)
  • FIB Sectioning and imaging (w/wo iterative slicing)
  • Process Metrology (inc. SI/SE imaging)
  • SEM EDS studies
  • FIBxTEM Sectioning
  • TEM imaging analysis (TEM/STEM) – BF/DF
  • TEM X-ray or EELS elemental analysis
  • Written report

Based on your description of the issue identified, we will propose a workflow with a level of detail and a cost for the analysis process prior to starting the project. Should additional investigative work be required during the analysis this can be easily added at the time.


EMMI fault finding with metal layers removed by FIB.



Non-destructive X-ray analysis of packaged parts.


Adding probe pads to any node for electrical debug.

Merry Christmas 2023 – It’s been a Quality Year adding these exciting new Capabilities

Closure times – NanoScope is closed from 20th December 2023 to the 5th January 2024 Our big company NEWS is that we are now ISO 9001:2015 Certified In our bid to improve our services on all fronts, we are very proud to have achieved ISO 9001 certification at the end of 2023 – more details to follow. We have already implemented our Quality Management System so you may spot these changes when you use us next. Our NEW microscope this year is a Sonoscan D24 Acoustic Microscope (large area CSAM). this state-of-the-art CSAM is already providing pre- and post- JEDEC Reliability checks for stress testing batches of devices (inc MSL testing) its providing checks for voids in complex planar sandwiches of materials – like polymers and metals it is also used as a Failure Analysis diagnostic tool for on-board packaging as a compliment to our X-ray capability. Our New Technique this year is our Plasma FIB Capability. We can offer ThermoFisher Hydra capabilities to our customers now including Xe for rapid milling of large sections – up to 100’s of μm in size/depth Ar for low kV polishing of (S)TEM sections and FEG SEM for high resolution imaging and Analysis in-situ. Lastly our new Sample Preparation Technique is Mechanical Grinding and Polishing. As boards and modules get smaller and more complex, the boundary between substrate and die requires more advanced investigation, so the need for accurate mechanical sectioning as a starting point for any structural analysis becomes increasingly important. Good Mechanical prep is more often the starting point for a Plasma or Gallium FIB section. (Section of a Section... read more

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