MEMS Device Design
Structural Edit of MEMS components using FIB permits rapid prototype development
MEMS development engineers.
‘Structural Edit’ of MEMS components using FIB permits rapid prototype development.
This is the ability to quickly tweak the physical structure of a MEMS component to enable the rapid testing or qualification of its physical behaviour.
IC designers have routinely used FIB technology for 20 years. They have used it to shorten the development cycles of new chip designs, ramp up production yield, and reduce the costs and time to market of new products. Many IC companies have branched out into MEMS development and are already using inhouse FIB instruments to enhance their competitive edge for developing new MEMS products.
NanoScope can rapidly and precisely modify the physical structure of small and medium sized lots of test devices so that direct empirical performance data can be collected in a short time frame without having to develop complex or new modelling techniques. Designs can be adapted to related application and proof of concept for new designs can be quickly obtained using this method. To find out what is possible call NanoScope now.
Accelerometer spring modification (50% reduction in spring strength)
“NanoScope..have provided a highly professional FIB service, offering good advice to achieve the best results and fast turn-around. Their experience and understanding of the needs of Nanotech’s designers has been invaluable.”
IMAPS UK – Fundamentals of Electronic Packaging Tutorial – Circuit Nano-Surgery and Failure Analysis – September 2020
NanoScope gave an Online invited Tutorial on behalf of IMAPS UK on the 18th September on the subject of Focused Ion Beam (FIB) Circuit Nano-Surgery and Failure Analysis from Board to Gate.read more
Here are some examples of our new services, and how they complement our existing imaging and non-destructive analysis. There is a quick guide to the specific advantages of each technique to show how your FA, NPI or development project can benefit.read more
IC Decap, MEMS Gel coat removal and through WL-CSP modification capabilities available nowread more