MEMS Process Engineers
'3D Structural Analysis’ of MEMS structures using FIB solves construction issues.
MEMS Process engineers
Understanding the cause of process or functional failures requires the application of various microscopy techniques to site specific locations.
Whether your needs are simple metrology or a more detailed high resolution analysis, both can be delivered from the required location using the nano-sectioning capabilities of FIB. Applying SIM, SEM and TEM, all enabled with FIB, we can help you understand your device structure and any failure modes.
NanoScope’s fast turn-around ‘off the shelf’ expert service, makes this available at every level of MEMS development.
FIBxTEM section preparation from MEMS ‘cog’ (foil width ~20um)
Waveguide metrology – within a FIB milled section (result time 20 mins)
IMAPS UK – Fundamentals of Electronic Packaging Tutorial – Circuit Nano-Surgery and Failure Analysis – September 2020
NanoScope gave an Online invited Tutorial on behalf of IMAPS UK on the 18th September on the subject of Focused Ion Beam (FIB) Circuit Nano-Surgery and Failure Analysis from Board to Gate.
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E-Newsletter Summer 2019
Here are some examples of our new services, and how they complement our existing imaging and non-destructive analysis. There is a quick guide to the specific advantages of each technique to show how your FA, NPI or development project can benefit.
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E-Newsletter Spring 2014
IC Decap, MEMS Gel coat removal and through WL-CSP modification capabilities available now
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