FIB assisted electrical debug (micro-probing your layout) for 1st Silicon

FIB assisted electrical debug (micro-probing your layout) for 1st Silicon

Download here : FIB assisted electrical debug- June 2018 FIB assisted electrical debug (micro-probing your layout) for 1st Silicon (part of the NanoScope ‘Summer of Love’ rel1.1- 28 June 2018)   An often overlooked option in the race to get 1st Silicon devices working, is simple electrical probing (µm), but why is this? Well the reasons are all very human. We think because line-widths are getting smaller and top down access to (often) buried nodes is almost impossible (for anything that’s not top layer metal), that this technique is simply not applicable now. So the questions and options we consider run along these lines “How can I get through a WL-CSP package (for example) and get a needle onto a buried node to find the state of that node?  Impossible, right? And the track is only 90nm’s wide anyway, so the probing station I will need will not only be extremely expensive to buy/rent/use, but could be far away, meaning  I’ll have to travel and possibly spend a couple of days trying to get that to work. And even if everything goes well, it’s likely it won’t give me a clean contact and a clear answer which will be difficult to explain, even if I can get a needle down without breaking the circuit right away. And I’ll have to explain and justify this whole risky process to the project leader who’s not going to like it when I come back with half an answer, a big invoice to go with it and 2 weeks lost as well.” So instead of all that pain, it’s quite human of us...
I like my FIB technology updates to be OCCASIONAL, SHORT, INFORMED, HELPFUL, NOT TOO SERIOUS and FREE

I like my FIB technology updates to be OCCASIONAL, SHORT, INFORMED, HELPFUL, NOT TOO SERIOUS and FREE

Dear LinkedIN and NanoScope contacts – New and Old Firstly – thanks for being connected – If you are, then we share a mutual interest in a technical area where I, and my company NanoScope Services, are active. It could be FIB Circuit nano-surgery, Microscopes and accessories, FIB applications development, Failure Analysis, or even Marketing. But it could even be low cost qualification of automotive parts for space applications – so a diverse Nano-bag of outsourced R&D support, but all linked to advanced FIB Nano-engineering. I think LinkedIN is a great format for sharing updates – but I am terrible at this, and I need to improve. So… after several years of complete silence (hey, we’ve been busy…), it’s time again to reach out and renew those contacts and friendships from so many projects and collaborations. Over the next couple of months I’m going to post some LinkedIN articles about new techniques and capabilities – and how they can add value, and maybe how we can too. (check out some previews here, here, here and here if you are the impatient type) I can promise these feeds will have all the attributes I myself value in a message – they will be OCCASIONAL, SHORT, INFORMED, HELPFUL, NOT TOO SERIOUS and FREE (with a cool picture). Please comment if the urge takes you – good or bad, it’s all good, especially if it’s about something we don’t do yet, or something we can do better. Let’s start a conversation this Summer. With kind regards,...