– helping you get to market with new IC designs and new packages and solving your yield, production or field return problems.
Take 30 seconds to review your extended toolkit for comprehensive, logic to power, fast-turn, gate-to-board issues.
1) FIB IC Nano-surgery to pre-test your metal fix without the risk.
2) Failure Analysis for Silicon and Compound devices, Chiplets and PCB’s.
3) Reliability testing for packages (HAST,THB,PreCon etc.) with onsite CSAM.
4) RevEng for Technology reviews from 7nm’s up to Power modules.
5) 24hr Si and III/V FAB process Quals
6) Nano-Materials imaging and analysis
Recent Comments