Laser Assisted Decap of Plastic IC packages.

 This has become a routine tool for IC Failure Analysis of Silicon and III/V devices, for FIB IC Nano-Surgery (FIB EDIT), and for Reverse Engineering for IP/Fake/Benchmarking checks.
Copper bondwires, III/V die and shrinking package sizes have made it increasingly difficult to use an Acid-only approach to exposing part or all of a die surface.
But you can’t just ablate all the plastic and expect the chip to still work, most laser wavelengths damage gates so it is still necessary to use wet chemistry under specific conditions for exposing the die surface.