Merry 3D X-ray X-mas from NanoScope Services

This X-ray map is of a 3 layer, FIB milled pattern in a 3 layer metal stack (Au, W and Al).

Our Xmas holiday is from 20th Dec to 6th Jan.

As 2024 draws to a close, we wish you a very Merry Christmas and a relaxing break.
For 2025 we hope that your Nano-structures are well formed, your FAB processes well qualified, that your designs are ‘right-first-time’ and failure-free, your packaging and PCBs are reliable and your joints well soldered.

If you have trouble with any of these, then we look forward to working with you next year.

 

How did we create a 3D X-ray map?

Step 1 – was to FIB deposit 0.5um of Tungsten onto an Aluminium (Al) bond pad on a standard Silicon
IC. This was followed by 0.25um of Plasma Gold (Au).

Step 2 – was to FIB mill 2 modified images into these layers. The first to
etch through the Gold to reveal the Tungsten, the second to mill
through the Tunsgten to expose the Aluminium bond pad.

Step 3 – was to capture a SEM backscattered image to confirm the 3
different materials were properly exposed. The contrast is caused by
the z difference in the materials.

Step 4 – was to map the Gold that remains on the surface of the
sample, and the Tungsten and the Aluminium that have been exposed
by the FIB milling.

Step 5 – was to combine the 3 maps in the appropriate colours.

Image 1 is a FIB-SE image of the final 3 level structure.

Image 2 is a FEG SEM backscattered electron image showing materials contrast.

Image 3 is a SEM EDS map of Gold.

Image 4 is a SEM EDS map of the exposed regions of Tungsten.

Image 5 is a SEM EDS map of the exposed regions of Aluminium.

 

 

 

 

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