News & Articles
Keep up to date with all the latest NanoScope news and technical articles.
E-Newsletter Winter 2008
NanoScope is entering its 3rd year as an independent lab, and now adding non-destructive techniques for packaging analysis.
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NanoScope now offers Cryo-DualBeam capabilities, new techniques for modifying IC’s with copper, and new repackaging options.
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NanoScope is growing quickly – we have added new circuit edit and TEM sample prep. capabilities, introduced new commercial offerings for regular users and launched our new company website.
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