News & Articles
Keep up to date with all the latest NanoScope news and technical articles.
The Problem With Copper Bond Wires…. For Designers
The move from Gold to Copper bond wires shaves a finite fraction from the cost of bonding a device, but also presents an additional challenge for opening up these packages.
read moreNano-Fabrication: Learning From The Electron Beam Lithography Playbook
What’s new for FIB heads? Well this example shows a high precision, fully automated, large pattern FIB milling operation, being used to directly fabricate a working Fresnel Zone Plate lens.
read moreFIB is cool – but what about blogging?
Apparently the only two things that you should never try are folk music and incest, so blogging must surely be in the other column. Well here goes….
read moreMEMS Flyer 2013
Expert FIB Nano-Surgery Services for MEMS Applications – ’off the shelf’
read moreE-Newsletter Spring 2013
NEW Optical Microscopy over the web We’ve extended our unique ‘LiveFIBTM’ web conference capability, with high resolution Optical Microscopy.
read moreE-Newsletter – Spring 2010
FIB goes LIVE- NanoScope introduces a unique innovation in outsourced services with ‘FIB on the Web’ consultancy.
read moreE-Newsletter Winter 2008
NanoScope is entering its 3rd year as an independent lab, and now adding non-destructive techniques for packaging analysis.
read moreE-Newsletter Winter 2007
NanoScope now offers Cryo-DualBeam capabilities, new techniques for modifying IC’s with copper, and new repackaging options.
read more
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